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Chip bead(磁珠) for EMI
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FI SERIES

High Current Chip Bead
  1. Used on high current circuits due to its low
  2. High reliability due to an entirely monolithic structure
  3. Low DC resistance structure of electrode prevents wasteful electric power consumption
  4. Suppress EMI/RFI and to prevent self-oscillation in electronic products
  1. 1.60 * 0.80 * 0.80 - FI160808
  2. 2.00 * 1.20 * 0.90 - FI201209
  3. 3.20 * 1.60 * 1.10 - FI321611
  4. 3.20 * 2.50 *1.30 - FI322513
RoHS, Halogen free
VA01
規格下載(205 KB)
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